Separation of Tantalum from Electronic Components on Laptop Printed Circuit Board Assembly

Assembly and Printed Circuit Board (pcb) Package

Optimization of electronic devices placement on printed circuit board

Power densities generated in today’s electronic components arise very quickly. Optimal placement of the devices on the board plays very important role for dissipation of power to the ambience. Each electronic component, as a heat source, thermally interacts with other ones. Forced convection is still one of the most important ways of heat dissipating from electronic components. When fluid moves...

Separation of Printed Circuit Board by Temperature Shock

In this contribution we are dealing with the possibility of electronic waste separation by temperature effect. It gives a possible direction how to solve the problem of increasing with electronic waste not only in Czech Republic, but also throughout the world. Further, we are dealing with of heat transfer inside the printed circuit boards (PCB) and with thermal longitudinal expansion of used ma...

Printed circuit board inspection

This paper provides a general overview of immediate and long-term aims of the printed circuit board inspection project of The Robotics Institute. Its purpose is to highlight some of the significant issues specific to printed circuit board inspection and to provide a discussion of our basic thesis that machine inspection should be coupled with machine diagnosis of the causes of observed printed ...

Process Optimization for Flexible Printed Circuit Board Assembly Manufacturing

Copyright 2012 KIEEME. All rights reserved. This is an open-access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/3.0) which permits unrestricted noncommercial use, distribution, and reproduction in any medium, provided the original work is properly cited. pISSN: 1229-7607 eISSN: 2092-7592 DOI: http://dx...